Tsev -

Txog Peb - Keeb kwm kev loj hlob

Pom nyob rau hauv 2000. Nyob rau lub Tsib Hlis 2016, nws tau ntse teev nyob rau hauv lub teb chaws NEEQ Tshuag lag luam nrog cov Tshuag code "836879", hu ua "Mingde shares, thiab ces tsim Guangdong muag chaw ua hauj lwm nyob rau hauv Dongguan.


Chip R & D Achievements

Ø Core Chip Core Chip

★ 2005 tsim TVS nti manufacturing txheej txheem 2005 tsim TVS nti manufacturing txheej txheem;

★ 2006 tsim 2006 tsim zzener ener nti manufacturing nti manufacturing txheej txheem;

★ 2009 tau tsim cov tshuab epitaxial los tsim cov txheej txheem SF nti 2009 tsim cov tshuab epitaxial los tsim cov txheej txheem SF nti;

★ 2010 tsim cov tshuab epitaxial los tsim DB3 nti txheej txheem 2010 tsim cov tshuab epitaxial los tsim DB3 nti txheej txheem

★ 2010 tsim cov tshuab epitaxial los tsim DB3 nti txheej txheem 2010 tsim cov tshuab epitaxial los tsim DB3 nti txheej txheem;

★ 2011 tsim DU3 nti manufacturing 2011 tsim DU3 nti manufacturing proces proces nrog patent txoj cai nrog patent txoj cai;

★ 2017 tsim lub zog siab TVS nti 2017 tsim lub zog siab TVS nti; Ø Chip Advantages Chip Advantages

★ 20 xyoo dhau los R & D pab pawg 20 xyoo dhau los R & D pab neeg

★ TCAD TCAD computer analog technology


Package Achievements

★ 2007 2007 tsim tsim MSMA, SSODOD--123FL pob khoom 123FL pob khoom;

★ 2008 Invented 2008 Invented MMBFBF, tuav patent tuav patent ;

★ 2010 2010 tsim RS tsim RS--C2 Dual C2 Dual--core non core non--interconnect package interconnect package products products ;

★ 2013 tsim dual dual 2013 tsim dual dual--core non-core non--interconnect pob interconnect pob

Cov khoom lag luam: SOF2 SOF2--44 ( Subminiature Surface Mount Rectifier Choj Subminiature Surface Mount Rectifier Choj ),

TOTO--277C,SIP2 SIP2--55 (ib theem choj ib theem choj, peb theem choj peb theem choj)

★ 2016, tsim SOD 2016, tsim SOD--323 323 pob khoom pob khoom